TMCNet: Toradex Announce New Windows CE BSP and Images V4.2beta1 for Colibri

[February 01, 2013]

Toradex Announce New Windows CE BSP and Images V4.2beta1 for Colibri

Horw, Switzerland, Feb 01, 2013 (PRWeb.com via COMTEX) -- Toradex has released a new beta version of the Windows CE 5 and Windows Embedded Compact 6 images and BSPs. The new V4.2beta1 version addresses a few bugs and includes the latest Microsoft Windows CE updates.


For more details about the changes please take a look at the image change log file located on the Toradex website at: http://developer1.toradex.com/files/toradex-dev/uploads/media/Colibri/WinCE/Images/Betas The Windows CE workspace file is now also available to download for free. For more information please visit the Toradex developer website at: http://developer.toradex.com/software-resources/arm-family/windows-ce/platform-builder-workspaces You can find all downloads, including the BSPs, binary Windows CE images, and bootloader, on the Toradex developer website download page at: http://developer.toradex.com/frequent-downloads About Toradex Founded in Switzerland, today the Toradex network stretches across the world. Its direct sales model and local service approach puts Toradex in regular contact with more than 3,000 customers around the globe. Toradex supplies embedded computer modules for demanding applications and offers premium support service to help its customers rapidly bring product to market. Toradex's strategic vision and long term orientation makes it the company of choice for ambitious and creative people.

Toradex products are deployed within a diverse range of markets and industries. Typical industries include: automotive, medical devices, laboratory equipment, point of sales, gaming machines, navigation systems, musical instruments, machine control, virtual reality simulation, digital signage, traffic control systems, building automation, security systems, robotics, process control and auto pilots.

Swiss. Embedded. Computing.

Meet our engineers at: ISA Vision Summit, Bangalore, India, February 14-15, 2013 EFY EXPO, Delhi, India, February 21-23, 2013 embedded world, Nuremberg, Germany, February 26-28, 2013 DESIGN West/ESC Silicon Valley, San Jose, USA, April 22-25, 2013 ESC Bangalore, India, July 17-19, 2013 IPC&EMBEDDED EXPO 2013, ShenZhen, China, August 1-3, 2013 DESIGN East/ESC Boston, USA, September 30 - October 3, 2013 Read the full story at http://www.prweb.com/releases/2013/2/prweb10377912.htm PRWeb.com

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